[1]项东,贾立群,罗辉,等.金刚石化学镀Ni-W-P金属薄膜研究[J].山东建筑大学学报,2009,(05):389-391.
 XIANG Dong,JIA Li-qun,LUO Hui,et al.Study of electroless plating Ni-W-P metal film on the diamond surface [J].Journal of Shandong jianzhu university,2009,(05):389-391.
点击复制

金刚石化学镀Ni-W-P金属薄膜研究()
分享到:

《山东建筑大学学报》[ISSN:1673-7644/CN:37-1449/TU]

卷:
期数:
2009年05期
页码:
389-391
栏目:
研究论文
出版日期:
2009-10-15

文章信息/Info

Title:

Study of electroless plating Ni-W-P metal film on the diamond surface

作者:
项东贾立群罗辉王献忠
山东建筑大学 材料科学与工程学院,山东 济南,250101
Author(s):
XIANG DongJIA Li-qunLUO Hui et al.
School of Materials Science and Engineering, Shandong Jianzhu University, Jinan 250101,China
关键词:
关键词:金刚石化学镀金属薄膜碳化物抗压强度
Keywords:
Key words: diamond electroless plating metal film carbide compressive strength
分类号:
TQ164;TG174
文献标志码:
A
摘要:
摘要:选择了适宜的化学镀预处理工艺,确定了化学镀Ni-W-P的合理配方和工艺参数,采用SEM、XRD等检测方法,对化学镀及热处理后金刚石表面形成的金属薄膜进行了分析。结果表明:经化学镀后金刚石表面形成了较致密的金属薄膜,抗压强度提高且最大幅度可达到27.14%;对金刚石化学镀后再经过850℃热处理的XRD检测,证明金刚石表面与薄膜之间已形成碳化物WC,此时金刚石抗压强度比未镀覆时提高了约16.28%。
Abstract:
Abstract: A suitable pretreatment technology is utilized before the plating and prescriptions and technical parameters of electroless plating Ni-W-P are also confirmed. The testing methods such as SEM, XRD and so on were adopted to analyze the metal films on diamond after electroless plating and heating treatment. The testing results showed that the finer plating films on the diamond surface were formed after the plating. The compressive strengths of the plating films increased up to 27.14%. The XRD result proved that some carbides, such as WC, were formed on the surface between the diamond matrix and the plating film after heat treatment. So the compressive strength of the diamond became 16.28% higher than before.
更新日期/Last Update: 2009-10-19